TECHNICIAN 4, MANUFACTURING
Core
Operating and monitoring die bond/clip bonder and wire bonder machines to ensure stable production output in semiconductor manufacturing.
Role type
Manufacturing Technician (Die Bond/Wire Bond)
Builds
Semiconductor chips and components
Domain
Semiconductor manufacturing
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Machine operation, SOP adherence, machine setup, alignment, recipe loading, parameter adjustment, preventive maintenance, data recording, process monitoring, basic troubleshooting, ESD handling
Preferred skills
Semiconductor process experience (die attach, wire bonding, mold-trim, final test), shift work adaptability
Technologies
ASM (AD838, Twin 832P, SD890A, AD832D, Extreme family, Twin supreme, Eagle 60), Shinkawa/Yamaha (SPA 500, STC 500, ACB 3000, ACB 1000, UTC 5100), Kns (Connx Plus & Elite)
Responsibilities
Operate and monitor die bond/clip bonder and wire bonder machines; Perform die/clip attach and wire bond processes according to SOP; Conduct machine setup, alignment, and recipe loading; Perform regular machine checks, cleaning, and minor preventive maintenance; Identify process abnormalities and report issues; Record production data accurately; Ensure workplace 5S, safety compliance, and ESD handling
Seniority
Entry to Mid-level, hands-on IC