Advanced Packaging Design Engineering Team Leader (Hybrid)
Core
Lead complex advanced IC package design programs and grow the San Jose package design team for high-performance Silicon ASICs.
Role type
Senior IC advanced packaging design team leader
Builds
High-speed, robust, and scalable Silicon ASICs for global networks
Domain
Semiconductor / Advanced Packaging / Networking
Required skills
High-speed package design, Signal integrity (SI), Power distribution networks (PDN), EDA tools for package layout, Technical leadership, Cross-functional collaboration
Preferred skills
ASIC package design, Silicon floor planning, Testing and measurement equipment, Scripting languages (Python, Perl, TCL, shell)
Technologies
EDA tools, Oscilloscopes, TDR/VNA analyzers
Responsibilities
Lead complex package design programs from concept to tapeout, Optimize package pinouts and stack-ups, Collaborate with SI/PI and layout teams, Mentor engineers and develop team capability, Enhance design methodologies and partner with vendors, Drive innovation in package solutions
Seniority
Senior, hands-on IC with team leadership
