IC Package Layout Team Leader
Core
Lead and grow the San Jose package layout team while supporting complex ASIC packaging projects, providing technical guidance, mentorship, and resource coordination.
Role type
Senior IC Package Layout Team Leader
Builds
Advanced ASIC hardware platforms for Cisco Switching, Routing, and Wireless products
Domain
Semiconductor hardware engineering / ASIC packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Package layout design, high-speed routing, power distribution networks (PDN), EDA tools for package layout, cross-functional collaboration, team leadership, project resource coordination
Preferred skills
Mentoring layout engineers, Cadence APD+, scripting languages (Python, Perl, TCL), vendor management, SI/PI considerations
Technologies
Cadence APD+, EDA tools
Responsibilities
Lead and support the San Jose package layout team, Support package layout activities for complex ASIC packaging projects, Collaborate with package leads, SI/PI teams, and manufacturing partners, Coordinate layout resource allocation and staffing, Support optimization of package pinouts and high-speed interface implementation, Partner with global leaders to align methodologies and standards, Contribute to hiring and development of layout engineering talent
Seniority
Senior, hands-on IC with team leadership
