Advanced Packaging Technical Leader
Core
Drive innovation in advanced packaging technology and quality for Cisco's cutting-edge Optics products, operating at the intersection of advanced technology and strategic execution.
Role type
Senior IC Advanced Packaging Technical Leader
Builds
Next-generation optics packaging solutions for Cisco products
Domain
Semiconductor manufacturing / Optics / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Advanced packaging assembly processes (flip-chip, fanout, 2.5D/3D, hybrid integration), Package assembly, Process development, Reliability qualification, Materials and testing, Design for Manufacturability (DfM), Design for Reliability (DfR), Failure analysis (FA), Root cause finding, Commodity strategy, Risk mitigation
Preferred skills
Industry standard reliability testing, Simulation and modeling software, Basic failure analysis
Technologies
Flip-chip, Fanout, 2.5D, 3D, Hybrid integration
Responsibilities
Oversee package assembly, process development, reliability qualification, materials and testing; Develop and qualify packaging solutions with top-tier partners; Mitigate risks and resolve complex packaging issues; Influence package architecture and provide expert guidance on DfM/DfR; Evaluate new packaging methods, materials, and processes
Seniority
Senior, hands-on IC