Packaging Substrate Engineer
Core
Lead SoC package substrate technology development, pathfinding, and roadmap definition for Apple's consumer electronic products.
Role type
Senior IC packaging substrate engineer
Builds
New-generation package substrate solutions for iPhone, iPad, Mac, Apple Watch, Apple TV
Domain
Consumer electronics hardware packaging
Required skills
substrate technology development, manufacturing process expertise, material science, mechanical engineering fundamentals, cross-functional collaboration, project management, technical problem solving
Preferred skills
MS or Ph.D., substrate manufacturing hands-on experience (Cu plating, lithography, dielectric materials, via formation, solder resist, surface finish), package assembly integration knowledge, Cadence Allegro DFM tools
Technologies
Cadence Allegro, Cu plating, lithography, dielectric materials, via formation, solder resist, surface finish
Responsibilities
Lead SoC package substrate technology development and roadmap definition; Work with industry partners to bring package substrate solutions from concept to HVM; Define and optimize new package substrate architectures based on performance, risk, cost, and availability; Solve technical issues during the full product development cycle
Seniority
Senior, hands-on IC
