Substrate Technologist
Core
Lead RFSIP package substrate development, pathfinding technology, and roadmap definition for Apple's consumer electronic products.
Role type
Senior IC substrate technologist (hardware packaging)
Builds
New-generation package substrate solutions for iPhone, iPad, Mac, Apple Watch, Apple TV
Domain
Consumer electronics hardware packaging
Required skills
substrate technology development, manufacturing process knowledge, cross-functional engineering collaboration, technical problem solving, project management, material/chemistry/mechanical engineering fundamentals, DFM review, industry partner management
Preferred skills
MS or Ph.D., substrate manufacturing hands-on experience (Cu plating, Lithography, Dielectric material, Laser via formation, Solder resist), package assembly and integration process knowledge, Cadence Allegro platform tools proficiency
Technologies
Cu plating, Lithography, Dielectric material, Laser via formation, Solder resist, Cadence Allegro
Responsibilities
Lead RFSIP package substrate development from concept to HVM; Work with cross-functional groups to define & optimize new package substrate architectures; Problem solving of technical issues during the full product development cycle
Seniority
Senior, hands-on IC
