DFM R&D Engineer — Advanced Simulation & Materials
Core
Develop predictive finite element models and material characterizations for semiconductor packaging, PCB systems, and SMT assemblies to ensure manufacturing readiness and reliability.
Role type
Senior IC DFM R&D Engineer (Advanced Simulation & Materials)
Builds
Predictive mechanical models and validated material libraries for microelectronics packaging
Domain
Semiconductor manufacturing / Mechanical engineering
Deliverable
production ML models | product features
Required skills
Finite element modeling (implicit/explicit), Solid mechanics, Thermomechanics, CAE tools (Ansys/Abaqus), Material characterization, DOE design, Reliability physics, Root cause analysis
Preferred skills
Warpage/fracture/fatigue modeling, SMT process familiarity, Simulation-test correlation, DOE methodology
Technologies
Ansys, Abaqus
Responsibilities
Develop and execute finite element models for semiconductor packaging and PCB structures; Analyze thermo-mechanical behavior including warpage, stress, drop/shock, and fatigue; Lead material characterization efforts for microelectronics materials; Build and validate material models using experimental data; Design and execute DOEs to correlate simulation with test results; Drive early design optimization and support root cause investigations of mechanical failures
Seniority
Senior, hands-on IC
