Packaging Assembly Engineer
Core
Lead development, optimization, and sustaining of advanced flip-chip BGA (FCBGA) assembly processes from pathfinding through high-volume manufacturing for SoC projects.
Role type
Senior IC Packaging Assembly Engineer
Builds
Advanced FCBGA packages and related semiconductor solutions
Domain
Semiconductor manufacturing / IC Packaging
Required skills
FCBGA assembly process definition, DOE design and statistical analysis (SPC), root-cause analysis, DFM input for pad/bump design, NPI build support, continuous improvement, supplier interface, materials evaluation
Preferred skills
M.S./PhD in Materials/Mechanical/Chemical/Electrical Engineering, 5+ years in Semiconductor Packaging, knowledge of 2.5D/3D packaging and MCM, memory packaging expertise, package design software (APD, Virtuoso), program management
Technologies
FCBGA, flip-chip attach, underfill, lid/heat spreader, ball attach, singulation, APD, Virtuoso
Responsibilities
Define and optimize end-to-end FCBGA assembly process flow; Develop and maintain process documentation including specs, work instructions, and PFMEA; Plan and execute DOEs to improve yield, quality, and cost; Lead root-cause analysis for assembly excursions and yield issues; Partner with design teams to provide DFM input on pad/bump design and stack-up; Support NPI builds and ramp at OSAT sites; Drive continuous improvement projects for cycle time, throughput, and cost reduction; Interface with equipment and materials suppliers to evaluate new tools and technologies
Seniority
Senior, hands-on IC
