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Principal Subsystem Design Engineer

United States, North Carolina, Raleigh💼 Full-time🗓 2026-09-04 → 2026-09-26

Core

Lead the design, integration, and verification of high-performance, complex SoC memory subsystems, driving solutions from architecture through silicon bring-up.

Role type

Principal Subsystem Design Engineer (Memory/SoC)

Builds

High-performance SoC subsystems including PCIe, HBM, imaging, control, interconnect fabrics, and DMA engines

Domain

Semiconductor / Hardware Design / SoC Architecture

Deliverable

production ML models | product features

Required skills

Microarchitecture specification, RTL development (Verilog/SystemVerilog), Design verification, Synthesis, Timing constraints, PPA optimization, Post-silicon debug, DFT, Cross-functional leadership, Agile execution, Scripting (Python/Perl)

Preferred skills

Experience with AI/ML SoCs, Experience with CPUs/VPUs/GPUs/DMA/Tensor units, Experience with AMBA AXI/CHI protocols, Experience with NoCs

Technologies

Verilog, SystemVerilog, Python, Perl, PCIe, HBM, AMBA AXI/CHI, NoC

Responsibilities

Lead design and integration of memory subsystems, Mentor engineers and conduct design/code reviews, Debug complex system-level issues across simulation and silicon, Drive IP reuse across platforms, Collaborate with Architecture, RTL, DV, PD, and Firmware teams

Seniority

Principal, hands-on IC with strategic leadership

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