Thermal Mechanical Modeling Engineer, Texas Institute for Electronics
Core
Lead and execute comprehensive thermal and mechanical simulations for advanced 2.5D/3.0D heterogeneous integration and multi-material semiconductor packages.
Role type
Senior IC thermal mechanical modeling engineer (semiconductor packaging)
Builds
Production simulation flows, ADK/PDK models, and verification data for chiplet and advanced substrate designs
Domain
Semiconductor manufacturing, advanced packaging, heterogeneous integration
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
multiphysics simulation, EDA/EM tools, package-level model extraction, scripting/automation, high-speed interconnect modeling, system-level co-simulation
Preferred skills
industry standards familiarity (IEEE, JEDEC, OIF), high-speed interconnect compliance testing, PDK/ADK validation, technical publications
Technologies
Ansys HFSS/SIwave, Cadence Sigrity/Clarity, Synopsys RaptorX, Siemens HyperLynx, Keysight ADS, COMSOL, CST Studio
Responsibilities
Execute hands-on semiconductor package mechanical and thermal simulations; Perform modeling and verification of high-speed interconnects and thermal management; Build and validate comprehensive ADK/PDK models; Run end-to-end simulation workflows including reliability checks; Collaborate with EDA vendors and foundries to refine simulation flows; Generate user guides and automation scripts; Guide technical strategy and mentor junior engineers
Seniority
Senior, hands-on IC
