CareerPlanGet AI match score →

Applications Engineer, 3D-IC Solution Sales

Hsinchu, TWN, Taiwan💼 Full-time🗓 2026-07-17 → 2026-07-22

Core

Support consultative sales efforts and secure technical design wins for Siemens EDA's 3D-IC product and service offerings.

Role type

3D-IC Solution Sales Engineer

Builds

Siemens 3D-IC solutions (Innovator3D Integrator, Calibre 3DSTACK, Calibre 3DThermal, Calibre 3DPERC, Calibre 3DStress)

Domain

Semiconductor / Electronic Equipment / 3D-IC Integration

Deliverable

client delivery

Required skills

BSEE or MSEE, 4+ years semiconductor experience, IC/packaging data formats (Verilog, LEF/DEF, GDS, OASIS, ODB++), 2.5D-IC and 3D-IC integration technology, Chiplet-based design concepts, scripting (Python, Tcl, Perl), Windows/Linux OS, English (professional working proficiency)

Preferred skills

Customer-facing role experience, 2.5D/3D-IC EDA cockpit solutions, IC package/interposer layout implementation, Siemens Calibre DRC/LVS experience

Technologies

Innovator3D Integrator, Calibre 3DSTACK, Calibre 3DThermal, Calibre 3DPERC, Calibre 3DStress, TSMC 3DFabric, Intel EMIB/Foveros, Cadence Integrity SystemPlanner, Synopsys 3DIC Compiler, Cadence APD

Responsibilities

Support consultative sales efforts, secure technical design wins, deliver technical presentations and product demonstrations, develop solutions and account strategies, integrate with global peers and communicate with stakeholders

Seniority

Mid-level, individual contributor

Sourced via siemens_eda · Listed on CareerPlan, which tracks 70,000+ jobs from 20+ sources.
Apply on Siemens ↗