SW/CAD Engineer- Physical Design
Core
Develop innovative software products and workflow solutions for advanced 2.5D and 3D System-in-Package (SiP) designs, integrating EDA and MCAD tools for physical design, place-and-route, and verification.
Role type
Software Engineer (Physical Design & Packaging)
Builds
Scalable, customized solutions and robust production code for physical implementation and packaging flows.
Domain
Electronic Design Automation (EDA) / Semiconductor Physical Design / 3D IC Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Python, Tcl/Tk, Bash scripting; ASIC physical design methodologies (floorplanning, placement, routing, CTS, timing closure, netlist-to-GDS); EDA infrastructure management; software data structures; flow managers and Makefiles; Linux/Windows environments.
Preferred skills
Place-and-route tools (Cadence Innovus, Synopsys Fusion Compiler, Siemens Aprisa); Physical verification tools (Calibre DRC, LVS, PEX); Package design tools (Cadence APD/SiP, Siemens Xpedition); 3D IC/3DStack solutions; IC analysis tools (HyperLynx, HFSS, RedHawk, Voltus, PrimeTime); FinFET technologies.
Technologies
Python, Tcl/Tk, Bash, Git, Linux, Windows, Makefiles
Responsibilities
Design, implement, maintain, test, and document software modules for physical design and packaging; Automate workflows and deploy production code; Identify and resolve complex physical design and packaging issues; Improve physical design flows for PPA optimization; Support integration of floorplanning, placement, routing, and verification flows; Manage design data and EDA infrastructure including tool installation and server environments.
Seniority
Mid-Senior, hands-on IC
