Field Application Engineer - Calibre 3DIC
Core
Field Application Engineer supporting IC and package designers with Calibre 3Dstack/3Dthermal/3Dstress tools for thermal, stress, and 3DIC analysis.
Role type
Field Application Engineer (EDA)
Builds
Calibre 3D solution flows and technical demonstrations for chip, board, and system design customers
Domain
Electronic Design Automation (EDA) / Semiconductor / Multiphysics
Deliverable
product features
Required skills
thermal analysis, stress analysis, 3DIC design, IC physical verification (DRC/LVS), custom IC/ASIC design flow, TCL scripting, Perl scripting, Linux
Preferred skills
customer interaction, technical presentation, bottleneck identification, R&D collaboration
Technologies
Calibre 3Dstack, Calibre 3Dthermal, Calibre 3Dstress, DRC, LVS, xACT, PERC
Responsibilities
Work with IC or package designers leveraging Multiphysics experience; Conduct technical presentations, demos, and training; Provide evaluation, benchmarking, and initial deployment support; Identify bottlenecks and file improvement suggestions; Establish customer relationships to facilitate sales objectives; Communicate field technical needs to R&D
Seniority
Mid-Senior, hands-on IC
