Wafer Fab Technician – Metallization, Dry Etch & Wet Etch
Core
Operate metallization, dry etch, and wet etch tools to run volume production of InP photonic devices (BH DFB lasers and BH Gain Chips) in a cleanroom environment.
Role type
Senior IC Wafer Fab Process Technician (Metallization & Etch)
Builds
InP Buried Heterostructure DFB lasers and BH Gain Chips
Domain
Semiconductor manufacturing / Photonics / III-V materials
Required skills
e-beam evaporation, sputter deposition, lift-off processing, contact alloying, ICP/RIE plasma etching, wet bench chemistry, root-cause analysis, SPC control charts, tool qualification, defect inspection, TLM testing
Preferred skills
III-V/InP process experience, dry etch and wet etch on III-V materials, operating deposition and metrology tools, mentoring junior staff
Technologies
e-beam evaporation systems, sputter deposition systems, ICP/RIE, rapid thermal anneal (RTA), four-point probe, profilometer, TLM test structures
Responsibilities
Operate e-beam evaporation and sputter deposition systems for metal stack deposition; execute lift-off, metal etch, and contact alloy processes; operate ICP/RIE and plasma ash systems for contact window opening; perform wet etch and bench chemistry maintenance; lead root-cause investigations for process excursions; own SPC control charts and process recipes; mentor operators and junior technicians.
Seniority
Senior, hands-on IC