Die Attach Manufacturing Engineer- Process & Equiment
Core
Lead development, qualification, and optimization of die attach processes and equipment for Photonic Integrated Circuits (PICs) and silicon photonics dies to achieve sub-micron placement accuracy and optical-grade quality.
Role type
Mid-to-senior Manufacturing Engineer (Process & Equipment)
Builds
Photonic Integrated Circuits (PICs), silicon photonics dies, and co-packaged optical/electronic modules
Domain
Silicon Photonics / PIC Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Die attach process engineering, Equipment qualification (IQ/OQ/PQ), Root cause analysis (8D, 5-Why), DOE/SPC/Cpk analysis, Wafer/die handling, Optical coupling yield optimization, Failure analysis, NPI support, Vendor management, Cleanroom operations
Preferred skills
High-volume silicon photonics experience, Active alignment with optical feedback, Hermetic packaging, Six Sigma certification, Statistical software (Minitab, JMP), Automation/robotics, MES systems
Technologies
Besi, Palomar Technologies, Finetech, Set North America, PI/Physik Instrumente, UV-cure stations, Vision systems, Sub-micron motion stages
Responsibilities
Develop and optimize die attach processes (epoxy, solder, flip-chip), Maintain high-precision die attach equipment, Lead equipment installation and preventive maintenance, Support NPI for new photonic packages, Collaborate on failure analysis and reliability testing, Provide technical training to manufacturing staff
Seniority
Mid-to-senior, hands-on IC
