[INTERN-APPRENTICE] Developpement Packaging Engineer
Core
Design and develop high-reliability electronic packages for complex components like data converters and microprocessors serving aerospace, defense, and medical markets.
Role type
Junior IC packaging design engineer (apprentice)
Builds
High-reliability semiconductor packages (organic/ceramic, BGA, FlipChip, Wire-Bonding) and System In Package (SIP) architectures
Domain
Semiconductor manufacturing / Aerospace & Defense
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Microelectronic packaging knowledge, PCB routing, electrical/thermal/mechanical simulation, technical documentation, component library creation, DRC verification
Preferred skills
Hardware electronics, signal integrity, power distribution network (PDN) optimization, high-frequency transmission line design
Technologies
Cadence APD, AutoCAD, Solidworks, Ansys HFSS, Icepack
Responsibilities
Update technical guides and checklists, define technical specifications for packages, interact with manufacturers and project teams, create component libraries and 3D models, perform electrical/thermal/mechanical simulations, conduct design reviews
Seniority
Junior, hands-on IC
