Advanced Lead – SiC/GaN Power Module Packaging Engineer
Core
Design, development, optimization, and implementation of manufacturing processes for GaN and SiC power modules used in high-efficiency, high-power-density power electronics.
Role type
Lead SiC/GaN Power Module Packaging Engineer
Builds
High-performance power modules for commercial and military aircraft systems
Domain
Aviation / Power Electronics / Semiconductor Manufacturing
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Power module packaging, semiconductor manufacturing, simulation analysis, statistical process control (SPC), root cause analysis, process documentation, training
Preferred skills
PhD in EE/Mechanical/Materials/Chemical Engineering, GaN/SiC manufacturing experience, knowledge of industry standards, problem-solving, analytical skills
Technologies
Simulation tools, SPC tools
Responsibilities
Collaborate on power module design and simulation analyses; Develop and optimize manufacturing processes (die attach, wire bonding, encapsulation, testing); Identify and implement process improvements to enhance yield and reliability; Develop and implement quality control procedures; Guide team in maintaining process documentation; Train production staff on new processes and equipment
Seniority
Lead, hands-on IC with mentorship responsibilities
