Staff Semi Packaging Engineer
Core
Drive IC package and power module development activities for new and existing analog products.
Role type
Staff Semi Packaging Engineer
Builds
Advanced IC package platforms, power modules, and assembly processes for analog ICs.
Domain
Semiconductor manufacturing, analog IC packaging, power modules
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Analog IC package and module design, package reliability and failure analysis, BOM selection for materials, CAD modeling, manufacturing control plans, FMEA, SPC, DOE
Preferred skills
Thermal/mechanical/electrical/magnetic simulation, PhD in relevant field
Technologies
CAD tools, FMEA, SPC, DOE
Responsibilities
Drive advanced package platform development, design and optimize IC packages and power modules, define package design rules, manage OSAT subcontractors, collaborate with cross-functional teams, manage project delivery
Seniority
Staff, hands-on IC
