Engineer II, Process Development Engineering
Core
Develop, setup, and operate DA or wire bond (Cu/Au) wire processes to support new product introductions and yield improvement.
Role type
Process Development Engineer (Manufacturing)
Builds
Semiconductor wire bonding processes and machine recipes
Domain
Semiconductor manufacturing / Analog Devices
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
DA or wire bonder operation, machine recipe development, tool/jig fabrication, DOE evaluation, process troubleshooting, documentation (FMEA, control plans), training delivery
Preferred skills
None stated
Technologies
DA equipment, wire bonder (Cu/Au)
Responsibilities
Develop and operate DA or wire bond processes, establish new machine recipes, fabricate modifications/tools for yield improvement, coordinate engineering/DOE evaluations, create process documentation, train engineers and operators, recommend material and process flows, solve process issues using analysis tools
Seniority
Experienced
