FOL Process Engineer
Core
Drive continual improvement in manufacturing procedures and processes for high-volume 300mm wafer Fab Analog Technologies production.
Role type
Manufacturing Process Engineer (Semiconductor)
Builds
Improved manufacturing efficiencies, yields, and quality for Analog Technologies products
Domain
Semiconductor manufacturing (300mm wafer Fab)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Statistical process control, engineering change control, process release strategies, 8D problem solving, DMAIC, DOE, data analysis, project management
Preferred skills
FOL-DA/SMT, AOI, SPI, Reflow, SMT, Flipchip Die, component attach, Vision inspection, QFN, Power Module packaging
Technologies
SMT, AOI, SPI, Reflow, Screenprint, Flipchip Die
Responsibilities
Develop and implement improved manufacturing methods and procedures, implement efficiency and cost reduction projects, perform lot and equipment dispositions, identify and resolve systematic process or equipment problems, support manufacturing ramp with equipment startup and process experiments, participate in data analysis and problem resolution
Seniority
Mid-level, hands-on IC