EOL Package Saw Process Engineer
Core
Drive continual improvement in manufacturing procedures and processes for high-volume 300mm wafer Fab Analog Technologies production.
Role type
Manufacturing Process Engineer (Semiconductor Packaging)
Builds
Improved manufacturing procedures, processes, and efficiencies for Analog Technologies products
Domain
Semiconductor manufacturing (300mm wafer Fab, Analog Technologies)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
statistical process control, engineering change control, process release strategies, 8D, DMAIC, DOE, lot and equipment disposition, process experiments (SWRs), data analysis, problem resolution
Preferred skills
Disco tool expertise, ADT tool expertise, Package/Laser sawing singulation knowledge, QFN/SMT/Power Module experience, semiconductor manufacturing technical knowledge
Technologies
Disco, ADT
Responsibilities
Support manufacturing operations, develop and implement improved manufacturing methods and procedures, implement project or improvement plans for efficiency/cost/quality, perform lot and equipment dispositions, identify systematic problems in process or equipment, support manufacturing ramp with equipment/process startup and process experiments, participate in data analysis and problem resolution
Seniority
Mid-level, hands-on IC