Staff Engineer, Semi Packaging Engineering
Core
Lead the design, development, and qualification of advanced semiconductor packaging solutions (wire-bond, flip-chip, SiP, modules) balancing reliability, manufacturability, and cost.
Role type
Staff Engineer, Semi Packaging Engineering
Builds
Semiconductor packaging solutions for various market segments
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
Semiconductor packaging development, Package mechanical and thermal analysis, FEM simulation (ANSYS), IC packaging materials knowledge, Substrate technologies, Semiconductor assembly processes, Cross-functional collaboration, Technical documentation
Preferred skills
FloTHERM, Sigrity, Icepak, Cadence Allegro
Technologies
ANSYS, FloTHERM, Sigrity, Icepak, Cadence Allegro
Responsibilities
Lead design and qualification of packaging solutions; Perform mechanical simulations of IC packages and systems; Perform component- and system-level thermal simulations; Collaborate with OSAT partners and suppliers to optimize manufacturing processes; Establish reliability criteria and qualification plans; Develop and maintain package design guidelines and technical documentation
Seniority
Staff, hands-on IC
