Engineer, Semi Packaging Engineering
Core
Design and develop advanced systems-level semiconductor packaging solutions for healthcare, industrial, robotics, and physical AI applications.
Role type
Systems Semiconductor Packaging Engineer
Builds
Advanced semiconductor modules, heterogeneous packaging solutions, multi-chip modules, and high-density interconnect assemblies.
Domain
Semiconductor manufacturing and systems integration
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Advanced semiconductor packaging design, system integration, manufacturing process development, reliability engineering, statistical data analysis, thermo-mechanical simulation, 3D CAD design, material science fundamentals, root cause analysis, design for manufacturability (DFM)
Preferred skills
Experience in regulated medical/industrial environments, knowledge of emerging packaging technologies
Technologies
SolidWorks, DOE, PFMEA, SPC, 8D, RCA
Responsibilities
Design heterogeneous packaging and multi-chip modules, lead assembly process developments, own manufacturing engineering activities including process characterization and yield improvement, drive statistical analysis for process capability, collaborate with OSATs and suppliers on package architecture and qualification strategies, present technical reports and communicate concepts to global teams
Seniority
Mid-level, hands-on IC
