Staff Equipment Engineer (Advanced Packaging)
Core
Lifecycle management and operational excellence of advanced semiconductor manufacturing tools for AI supercomputing photonics infrastructure.
Role type
Staff Equipment Engineer (Advanced Packaging)
Builds
Chip-to-chip optical interconnects and scalable photonic engines
Domain
Semiconductor manufacturing / Advanced packaging / Photonics
Deliverable
infrastructure
Required skills
wafer-level assembly machinery expertise, predictive maintenance strategy, equipment lifecycle management, root-cause analysis, vendor selection, FAT/SAT execution
Preferred skills
cleanroom environment experience, high-tech manufacturing experience
Technologies
back-grinders, stealth dicers, expanders, flip-chip bonders, pick-and-place systems, reflow ovens, solder paste printers
Responsibilities
Lead evaluation, selection, procurement, set-up, and qualification of new manufacturing equipment; Serve as subject matter expert for advanced packaging and wafer-level assembly equipment; Maintain high equipment up-time and minimize unscheduled down-time; Design, implement, and execute periodic and predictive maintenance programs
Seniority
Staff, hands-on IC with strategic ownership
