Senior Member of Technical Staff (Advanced Packaging Pathfinding)
Core
Drive pathfinding and early-stage technology development for N+2 and beyond advanced packaging architectures, translating emerging concepts into scalable capabilities for display and semiconductor manufacturing.
Role type
Senior IC advanced packaging pathfinding engineer
Builds
Novel packaging concepts, integration approaches, and demonstration vehicles for next-gen chips
Domain
Semiconductor manufacturing / Advanced packaging / Materials engineering
Deliverable
production ML models | product features | research | infrastructure
Required skills
Advanced packaging technologies (RDL, TSV, CoWoS, hybrid bonding), technology development, pathfinding, experimental validation, design-process co-optimization, system-level trade-offs
Preferred skills
Heterogeneous integration, chiplet architectures, next-gen interconnect technologies, innovation track record (patents/publications)
Technologies
D2W, RDL, CoWoS, TSV, heterogeneous integration schemes, mixed interconnect architectures, advanced bumping strategies
Responsibilities
Lead hands-on development and feasibility studies for novel packaging concepts; Design and execute experiments, simulations, and test vehicles to validate new ideas; Engage with stakeholders to translate customer requirements into actionable technical problems; Mentor junior engineers and influence cross-functional teams on technology direction
Seniority
Senior, hands-on IC with strategic influence