Optoelectronic IC Package Design Director
Core
Lead package development for custom in-house photonic, analog, and digital ICs to support next-generation optical modules.
Role type
Director of Optoelectronic IC Package Design
Builds
Custom photonic, analog, and digital IC packages for optical modules
Domain
Optoelectronics, High-speed connectivity, Semiconductor packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
IC package design, BGA configuration, package layout, SI/PI optimization, design verification, tapeout, cross-functional coordination, silicon floor planning, bump and package pin-out optimization, signal and power integrity simulation, RF performance optimization, vendor management
Preferred skills
Substrate design for RF/digital/mixed-signal, Advanced Package Designer (APD) and Xpedition Package Designer (XPD), SIWave and HFSS simulation, package design for manufacturing reviews, thermal and mechanical design, 2.5-D and 3-D IC interposer technologies
Technologies
Cadence APD, Cadence XPD, SIWave, HFSS
Responsibilities
Own and drive advanced package selection and new product BGA configuration; manage package development schedules; perform package layout, SI/PI optimization, design verification, and tapeout; interface with cross-functional groups for feasibility analysis; optimize silicon floor plan, bump, and package pin-out; simulate and optimize signal/power integrity and RF performance; coordinate with CMs and vendors for sourcing and future development
Seniority
Director, strategic leadership with hands-on technical execution
