SI/PI Tech Project Manager
Core
Lead a team of engineers designing complex flip-chip-BGA packages, PCBs, and system channel links for high-performance ASICs used in AI, networking, HPC, and 5G base stations.
Role type
Senior IC Technical Project Manager (Signal/Power Integrity)
Builds
High-performance package designs for ASICs supporting SerDes at 448G+, Optics, 5G RF/Microwave, HBM, and DDR5.
Domain
Semiconductor packaging, PCB design, and high-speed digital/analog systems (SerDes, Optics, RF/Microwave).
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Technical project management, team leadership, signal integrity (SI) and power integrity (PI) methodologies, EDA extraction and simulation, system-level SerDes channel analysis, lab measurement correlation, package and PCB lifecycle management, design data creation and utilization, automation code development.
Preferred skills
Experience managing people and projects, understanding of substrate and package trade-offs within system implementation.
Technologies
SerDes, Optics, 5G RF/Microwave, HBM, DDR5, EDA tools, Lab equipment.
Responsibilities
Navigate and track project plans for 20+ concurrent pkg/PCB designs, organize team and customer activities, create technical methodologies for SI/PI solutions, collaborate with cross-functional teams and vendors, support package and PCB technologies.
Seniority
Senior, hands-on IC with leadership responsibilities.
