ASIC Package Design Manager
Core
Lead a team of engineers designing complex flip-chip-BGA packages for high-performance ASICs serving AI, networking, HPC, and 5G base stations.
Role type
Senior IC Package Design Manager
Builds
High-performance ASIC packages with 448G+ SerDes, 5G RF/Microwave ADC/DAC, HBM, and DDR5
Domain
Semiconductor packaging, high-speed SerDes, AI/HPC/5G
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Team leadership, project management for 20+ concurrent designs, signal integrity (SI), power integrity (PI), substrate/package design lifecycle, design data management (POD/Lid/Substrate), DFx trade-offs, layout, SI/PI extraction and simulation, automation code development, mechanical and thermal modeling
Preferred skills
Management of people and projects, cross-functional collaboration, new business quoting
Technologies
flip-chip-BGA, SerDes, HBM, DDR5, 5G RF/Microwave
Responsibilities
Maximize team productivity and retention, create and track project plans, organize team and customer activities, communicate plans and risks, create technical methodologies, steer package technology and design rules, collaborate with vendors and cross-functional teams
Seniority
Senior, hands-on IC with management responsibilities
