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ASIC Physical Design Engineer

China-Shanghai-Zhangjiang Hi Tech💼 Full-time🗓 2026-06-17 → 2026-07-31

Core

Develop state-of-the-art IC solutions using Broadcom's leading-edge CMOS cell-based ASIC technologies through the full development lifecycle.

Role type

Senior IC Design Engineer (ASIC Physical Design)

Builds

28nm/16FF ASIC chips

Domain

Semiconductor / VLSI / ASIC Design

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Full chip synthesis flow (DC, DCT, DCG), Static Timing Analysis (STA), Floor planning, Placement, Design closure, DRC & LVS, RTL analysis, Design optimization, Timing verification, Simulation, Test insertion, Vector generation, Post-prototype test support, Perl/Tcl scripting

Preferred skills

DFT insertion, Power/IVD analysis, Tapeout experience in 28nm and beyond

Technologies

28nm, 16FF, 16nm, 7nm, CMOS, DC, DCT, DCG

Responsibilities

Perform full chip synthesis and static timing analysis; Execute physical design implementation including floor planning, placement, and design closure; Conduct DRC and LVS checks; Handle block implementation and top-level tasks independently; Support RTL analysis, design optimization, and simulation; Provide post-prototype test support.

Seniority

Senior, hands-on IC

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