Packaging Architect Design Engineer
Core
Architect advanced packaging solutions and define design rules for new 2.5D/3D packaging technologies.
Role type
Senior IC packaging architect design engineer
Builds
Advanced 2.5D/3D packaging solutions and test vehicles
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
GDSII-based physical layout, 2.5D/3D packaging architecture, .mcm-based layout, design-for-yield, design-for-cost
Preferred skills
.mcm-based layout
Technologies
GDSII, .mcm
Responsibilities
Architect advanced packaging solutions to meet future product requirements, Define design rules for new technology, Design test vehicles to support technology development, Generate design collaterals for new technology introduction, Drive design-for-yield and design-for-cost activities
Seniority
Senior, hands-on IC
