Sr. Director, Boards, Packages, Reliability
Core
Lead global silicon hardware engineering for chip package development, board development, and reliability to deliver advanced FPGA solutions at scale.
Role type
Sr. Director, Silicon Hardware Engineering (Boards, Packages, Reliability)
Builds
Advanced FPGA chips, custom boards, and reliable silicon solutions for AI, cloud, networking, and edge markets.
Domain
Semiconductor hardware engineering, advanced packaging, board design, and reliability.
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Advanced packaging (2.5D/3D IC, flip-chip), board-level hardware development, signal integrity (SI) and power integrity (PI) analysis, silicon power and reliability engineering, OSAT and vendor management, cross-functional team leadership, cost reduction strategy, tapeout quality optimization.
Preferred skills
M.S. in Electrical or Computer Engineering, experience with US and Asian site management, deep knowledge of synthesis, P&R, and timing closure.
Technologies
Ansys SIwave, Cadence Sigrity, HyperLynx, EDA tooling.
Responsibilities
Lead and grow three core engineering functions (package, board, reliability); define multi-year roadmaps and headcount plans; drive technical decision-making for advanced package technologies; oversee board-level hardware development from concept to bring-up; manage complex multi-vendor relationships with OSATs and fabricators; serve as primary engineering interface for silicon architecture and product management teams.
Seniority
Senior, hands-on IC leadership with strategic oversight.
