Casual - Parts, Materials, and Process Engineer
Core
Provide mission assurance support through parts, materials, and processes (PM&P) engineering for advanced semiconductor packaging in space and missile applications.
Role type
Senior IC Parts, Materials, and Processes Engineer (Semiconductor Packaging)
Builds
Technical recommendations and solutions for national intelligence electro-optical programs
Domain
Aerospace / Defense / Semiconductor Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
PM&P program management, advanced semiconductor packaging expertise, component selection, assembly materials, process qualification, root cause failure analysis, control boards, design reviews, manufacturing readiness reviews
Preferred skills
Master of Science in STEM, 20+ years space system acquisition experience
Technologies
None explicitly listed
Responsibilities
Support PM&P program management including selection, control boards, design reviews, and manufacturing readiness reviews; Provide technical consultation on advanced semiconductor packaging; Collaborate with industry and suppliers on qualification and failure analysis; Lead cross-organizational teams and represent the organization at technical meetings; Mentor less experienced staff
Seniority
Senior, hands-on IC with mentorship responsibilities
