Electronics Parts, Materials, and Processes Engineer - Advanced Packaging
Core
Managing parts, materials, and processes (PM&P) for advanced semiconductor packaging in space and missile applications.
Role type
Engineering Specialist - Microelectronics / Semiconductor Engineering
Builds
Space and missile systems components
Domain
Aerospace / Defense / Semiconductor Manufacturing
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Advanced semiconductor packaging expertise, PM&P program management, component selection and qualification, root cause failure analysis, control board management, design review facilitation, manufacturing readiness review leadership, cross-organizational team coordination, technical presentation and workshop facilitation, mentorship
Preferred skills
Team leadership in high-reliability applications, non-MIL PRF parts assessment, root cause analysis tool proficiency, project management software usage (MS Project, Jira), collaboration with industry working groups (NASA, DLA, JEDEC, AEC)
Technologies
2.5D/3D packaging, System in Package (SiP), Multi-Chip Module (MCM), MS Project, Jira
Responsibilities
Support PM&P program management functions including selection, control boards, design reviews, and manufacturing readiness reviews; Provide technical consultation on advanced semiconductor packaging for space and missile applications; Lead cross-organizational teams and organize interfaces; Collaborate with suppliers to create guidance for selection, screening, and qualification; Act as designated representative at technical meetings; Mentor less experienced staff
Seniority
Senior, hands-on IC with mentorship responsibilities
