Test and Finishing Technical Staff Engineer
Core
Deploy technical requirements on new subcontractors, define critical process characteristics, and drive yield and process improvement projects for semiconductor packaging.
Role type
Senior IC Test and Finishing Technical Staff Engineer
Builds
Semiconductor packaging solutions for automotive and consumer markets
Domain
Semiconductor manufacturing and packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor assembly processes, APQP, SPC, FMEA, DOE, 8D, statistical analysis, project management, complex technical problem solving
Preferred skills
NPI (New Product Introduction), automotive readiness, change management, benchmarking
Technologies
MS software
Responsibilities
Deploy technical requirements on new subcontractors, Define critical process characteristics with subcons to fit product characteristics, Lead yield and process improvement projects, Involve in package maturity (NPI), Involve in automotive readiness project, Develop workable system and template, Deploy ST technical projects, Manage change management, Package roadmap benchmarking
