Lead Silicon Packaging Technician, Silicon Assembly (Starlink)
Core
Lead a team of silicon assembly technicians in an in-house integrated circuit packaging and assembly operation for the Starlink satellite constellation.
Role type
Lead Silicon Packaging Technician (IC Assembly)
Builds
Integrated circuit packages and assemblies for Starlink satellites
Domain
Semiconductor manufacturing / Space technology
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
[Mentorship and training of technicians], [Escalation of non-conformance events], [Inventory management of BOM and consumables], [Process improvement and quality remediation], [Operation of surface mount and pick/place equipment], [Metrology and inspection using C-SAM, profilometers, X-ray], [Wafer singulation using dicing saws and laser tools], [Die attach and underfill/overmolding operations], [Cleanroom gowning and ESD compliance], [Recipe adherence for process stability]
Preferred skills
[Materials science or electrical engineering degree], [High volume semiconductor manufacturing experience], [Statistical process control (SPC) software proficiency], [Manual dexterity for microscope work], [Experience with Confocal Scanning Acoustic Microscopy and X-Ray Fluorescence]
Technologies
[Surface mount technology], [Automated optical inspection], [Reflow ovens], [Compression molding], [Laser marking], [Ball grid array], [Tape mount], [Singulation tools], [Physical vapor deposition], [Vision systems], [Scanning Acoustic Microscopy], [3D profilometers], [Ellipsometers], [Reflectometers], [X-ray systems], [Dicing saws], [Plasma etching tools], [Die attach equipment], [Epoxy dispensers], [Pick-and-place bonders]
Responsibilities
[Mentor and train silicon assembly technicians], [Escalate product non-conformance events], [Monitor BOM and consumables inventory], [Drive quality Pareto improvements], [Operate and maintain semiconductor packaging machinery], [Monitor process performance using metrology equipment], [Perform wafer singulation using dicing and laser tools], [Execute die attach and molding operations], [Ensure cleanroom and ESD compliance]
Seniority
Senior, hands-on IC