Package Technology Development Manager
Core
Lead package technology development, process flow path-finding, and material qualification for integrated power semiconductors.
Role type
Package Technology Development Manager
Builds
New package technologies and related process flows for semiconductor power delivery systems
Domain
Semiconductor industry, power electronics, package engineering
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
package technology and process development, wafer grinding, wafer saw, die attach, flip chip die attach, plasma clean, wire bond, molding process, laser ablation, laser marking, semiconductor supply chain knowledge, assembly sub-con management, package BOM vendor management, machine maintenance knowledge
Preferred skills
none stated
Technologies
none stated
Responsibilities
Lead team to develop new package technology and process flows, survey and qualify new materials for reliability and robustness, coordinate qualification of new materials and assembly processes, manage supplier relationships and develop supplier capabilities, maintain and update assembly baseline for package and SMT processes
Seniority
Senior, hands-on IC
