Senior Power Packaging Engineer
Core
Lead end-to-end packaging, structural design, and process development for high-power-density Power Shelf and PDB products in medium-to-high voltage environments.
Role type
Senior IC power packaging engineer (module-level)
Builds
800VDC/400VDC to 48V/12V/6V Power Shelf and PDB products
Domain
Semiconductor industry, power electronics, high-voltage module packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
PCB/PCBA DFM, substrate/board-level design rules, SMT, flip-chip, wire-bond, underfill, molding, failure analysis, mechanical design (SolidWorks, AutoCAD), high power-density assembly, potting materials, connector selection
Preferred skills
Power Shelf/PDB development, SiC/GaN packaging, process qualification, reliability testing
Technologies
SolidWorks, AutoCAD, SMT, flip-chip, wire-bond, underfill, molding
Responsibilities
Establish DFM guidelines for PCB fabrication and PCBA assembly; mitigate manufacturing and reliability risks; lead CoB and SiP package development; own process development for SMT, die attach, wire bonding, underfill, molding, and final coating; develop packaging processes addressing thermal and reliability challenges; participate in full product development cycle from concept to mass production validation
Seniority
Senior, hands-on IC
