Senior Substrate Technology Development Engineer
Core
Lead R&D of next-generation substrate technologies for advanced semiconductor packaging, driving innovation in design, materials, and processes while establishing engineering baselines for new manufacturing facilities.
Role type
Senior IC substrate technology development engineer
Builds
Advanced semiconductor packaging substrates (SIP, high power, high copper thickness)
Domain
Semiconductor industry, substrate materials and fabrication
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Substrate materials design rules, fabrication processes (laser drilling, plating, lamination), reliability testing, DOE, SPC, failure analysis, root-cause analysis, process characterization, capability analysis, yield ramp-up
Preferred skills
Cross-functional leadership, industry trend analysis, strategic development planning
Technologies
SIP, advantage laminates pp, high power substrate, high copper thickness
Responsibilities
Lead R&D and qualification of new substrate technologies; Collaborate with suppliers and vendors to implement innovative solutions; Define engineering baselines for new manufacturing facilities; Oversee process characterization and optimization during factory ramp-up; Drive root-cause analysis for fabrication and reliability issues; Guide strategic development plans based on industry trends
Seniority
Senior, hands-on IC