Package Design Engineer
Core
Develop advanced semiconductor package solutions for mixed signal, RF, microwave, and mmWave products, focusing on architecture, layout, and codesign for Networking & Radar and Automotive business lines.
Role type
Senior IC Package Design Engineer
Builds
Semiconductor packages (flip chip, wire-bond, WLCSP, FOWLP) for radio and amplifier solutions
Domain
Semiconductor packaging / RF / mmWave / Automotive
Required skills
Package architecture development, die-package codesign, package layout, design rule compliance, manufacturability optimization, reliability optimization, flip chip design, wire-bond design, WLCSP design, FOWLP design, controlled-impedance routing, grounding, shielding, signal-launch structures, substrate technologies, Geometric Dimensioning and Tolerancing
Preferred skills
Die-package-PCB codesign, Power Integrity, Signal Integrity, high-speed signal routing, differential pair implementation, return-path management, impedance-controlled interconnect design, analog SoC design
Technologies
Cadence Allegro Package Designer (APD), AutoCAD
Responsibilities
Develop package solutions meeting electrical, thermal, mechanical, reliability, manufacturability, and cost objectives; Utilize industry standard die/package co-design and layout tools; Participate in die/package/PCB codesign activities; Design and optimize package structures for RF and mmWave applications; Collaborate with simulation engineers to evaluate electrical performance; Support package design reviews and design-rule compliance; Partner with assembly sites and cross-functional teams to deliver robust solutions; Provide technical guidance on package architecture and assembly processes
Seniority
Senior, hands-on IC
