NPI Process Development Engineer
Core
Develop and qualify new LQFP & BGA packages for total assembly processes in automotive applications.
Role type
NPI Process Development Engineer
Builds
Semiconductor assembly processes for automotive customers
Domain
Semiconductor manufacturing / Automotive electronics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor assembly process development, LQFP packaging, BGA packaging, SiP, FCCSP, FCBGA, process characterization, laser dicing, plasma dicing, mechanical saw, die bond, wire bonding, mold, ball attach, marking, singulation, SPC, Process Control, statistical analysis, problem-solving
Preferred skills
Project Management, Microsoft Excel Macro
Responsibilities
Develop and qualify new LQFP & BGA packages, drive quality and yield improvement, create process documentation and standard work instructions, collaborate with cross-functional teams to resolve conflicts and mitigate risks, align project scope and direction with upper management
Seniority
Mid-level, hands-on IC
