Package Development Engineering – Product Integration Engineer (PDE PIE)
Core
Integrate AI tools into daily work, drive New Product Introduction (NPI) processes, and act as a technical integrator across manufacturing sites to bring new semiconductor packages into volume production.
Role type
Senior IC package development engineer (product integration)
Builds
New semiconductor packages and products for customers and partners
Domain
Semiconductor manufacturing and packaging
Required skills
Advanced package assembly flows, Die stacking, thin substrates, mold compound, warpage, mechanical reliability, NPI qualification frameworks, Yield analysis, statistical data interpretation, Failure analysis methodologies, Process characterization and validation
Preferred skills
Phase Gate / NPI business processes, Technology Development (TD) business processes
Technologies
Semiconductor packaging equipment, NPI qualification frameworks
Responsibilities
Integrate AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness; Contribute to a culture of continuous improvement by identifying, testing, and sharing AI-enablement enhancements; Drive New Product Introduction process through NPI Phase Gate Review; Coordinate new product start-up to achieve first pass qualification; Understand new product start-up datelines, product applications, and customer requirements; Work with process/equipment/manufacturing/planning area owners to bring new product and package into volume production; Provide timely support of First silicon, Engineering samples, Qual samples, and Engineering Hot lots cycle time; Regular monitoring of product yield trend, Quality Deviation Record (QDR), and reliability; Drive Electrical Failure Analysis (EFA) / Physical Failure Analysis (PFA) closure for NPI issues; Act as the technical integrator across multiple manufacturing sites and partners; Act as a point of contact to Technical Program Manager (TPM) on product related matters
Seniority
Senior, hands-on IC