External Package Innovation Engineer
Core
Drive external package innovation initiatives and collaborate with OSAT partners to execute semiconductor packaging projects from concept through production.
Role type
Senior IC package innovation engineer (OSAT ecosystem)
Builds
Next-generation semiconductor packaging solutions and production-ready assemblies
Domain
Semiconductor manufacturing / OSAT ecosystem
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor packaging expertise, hands-on assembly process experience (pre-assembly, wire bonding), NPI/NTI development flow management, cross-site project management, technology roadmap development, site selection strategy, project governance, technical problem-solving
Preferred skills
OSAT ecosystem experience, stakeholder management, standardization of development processes
Technologies
NPI/NTI development flows, Best Known Methods (BKM), stoplight reporting frameworks
Responsibilities
Lead OSAT-wide and cross-OSAT initiatives, define and deploy standard development templates, drive deployment of Best Known Methods, develop technology roadmaps, support NPI & NTI projects at external OSAT factories, ensure OSAT compliance with development processes, resolve technical and project issues across time zones, ensure assembly readiness and safe production launch
