Sr. Product Package Solution Engineer
Core
Lead packaging projects for New Product Introduction and New Technology Introduction across Mobile, Secure Communications, Wireless Connectivity, Power, IoT, and Radar applications.
Role type
Senior Product Package Solution Engineer
Builds
Packaging solutions for semiconductor ICs
Domain
Semiconductor manufacturing and IC packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Project management, risk assessment, risk mitigation, 8D problem solving, package platform knowledge (leadframe, laminate substrate, flip chip, Wafer Level Chip Scale Packaging), cross-functional coordination
Preferred skills
Foundry process knowledge, assembly process knowledge, failure analysis
Technologies
Leadframe, laminate substrate, flip chip, Wafer Level Chip Scale Packaging
Responsibilities
Lead packaging projects for NPI and New Technology Introduction, coordinate activities across marketing, IC design, applications, test, assembly engineering, and manufacturing, translate product requirements into package-specific specs, reliability, and cost targets
Seniority
Senior, hands-on IC
