Advanced CPO Packaging Technology Development & Integration Manager/Engineer
Core
Lead feasibility assessment and development of Co-Packaged Optics (CPO) and advanced wafer-level/panel-level packaging technologies, including 2.5D, 3D, 3.5D integration, EMIB, Fan-Out, and heterogeneous integration solutions.
Role type
Senior IC packaging technology development and integration manager/engineer
Builds
Co-Packaged Optics (CPO), optical modules, advanced logic-memory integration platforms (HBM, LPDDR)
Domain
Semiconductor manufacturing, advanced packaging, heterogeneous integration
Required skills
Feasibility assessment, NPI process planning, DOE development, yield analysis, root-cause investigation, supply chain management, cross-functional project leadership
Technologies
CPO, 2.5D, 3D, 3.5D integration, EMIB, Fan-Out, HBM, LPDDR
Responsibilities
Lead feasibility assessment and development of Co-Packaged Optics (CPO) and advanced wafer-level/panel-level packaging technologies; Drive NPI activities from engineering builds to production ramp-up including process planning, DOE development, yield analysis, root-cause investigation, and manufacturing yield improvement; Develop and implement packaging solutions for Co-Packaged Optics (CPO), optical modules, and advanced logic-memory integration platforms; Collaborate with foundries, OSAT providers, optical component suppliers, module manufacturers, and substrate vendors to evaluate technology capabilities, conduct technical assessments, support cost analysis, and oversee manufacturing readiness; Work closely with IC design, package design, testing, quality, and reliability teams to ensure technical requirements, project milestones, and product performance targets are successfully achieved
Seniority
Senior, hands-on IC
