Silicon Photonic Engineer (CPO)
Core
Developing high-performance photonic devices, process integration platforms, and advanced packaging for Co-Packaged Optics (CPO) to enable chip-to-chip optical interconnects for AI supercomputing.
Role type
Senior IC silicon photonics engineer (process integration & packaging)
Builds
High-volume production photonic engines and optical interconnects for AI infrastructure
Domain
Semiconductor manufacturing / Silicon Photonics / AI Infrastructure
Deliverable
production ML models | product features | infrastructure
Required skills
silicon photonics device design, optical interconnect concepts, process integration, backend assembly, advanced packaging, PDK development, cleanroom fabrication, device testing, yield improvement
Preferred skills
CPO architectures, high-speed optical interconnects, Cu bumping, laser diode attach, TSV, fiber assembly, PDK development for silicon photonics
Technologies
Silicon photonics platforms, PDKs, backend assembly tools
Responsibilities
Develop and optimize silicon photonic devices and building blocks for CPO platforms; Contribute to creation and refinement of process integration flows including backend and advanced packaging; Support evolution of PDK components and design rules; Partner with cross-functional teams to align technical requirements; Guide products through full lifecycle from development to ramp-to-production; Investigate device or process issues and drive corrective actions; Participate in customer and partner engagements to accelerate design cycles
Seniority
Senior, hands-on IC
