Engineer, HIG-HBM Product & System Engineering (Media Health Manufacturing)
Core
Drive manufacturing test flow development, validation, and yield improvement for next-generation High Bandwidth Memory (HBM) products including DRAM, interface, and stacked die.
Role type
Senior IC semiconductor product and system engineering (manufacturing test)
Builds
High-volume manufacturing test flows and validated HBM products for data center and AI applications
Domain
Semiconductor manufacturing / Memory technology (HBM, DRAM)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
CMOS technology, DRAM architecture, device physics, circuit design, root cause analysis, yield improvement, test coverage optimization, CAD tools, Verilog simulations, data analysis, statistics, Python, JMP
Preferred skills
Semiconductor device experience, product validation experience
Technologies
Python, JMP, CAD tools, Verilog
Responsibilities
Ensure optimized test coverage on current and future HIG HBM design architectures; Develop, validate, characterize, and qualify next-generation HBM products; Support design verification and circuit analysis using CAD tools and Verilog simulations; Improve manufacturing test yields and reduce test time; Resolve root causes of manufacturing test flow, qualification, and RMA device issues; Promote innovation to maintain technical competitive advantage; Mentor team members; Make technical decisions on risk analysis and project prioritization; Collaborate with cross-functional teams including Fab, Design, and Quality/Reliability
Seniority
Senior, hands-on IC