Engineer, HIG-HBM Product & System Engineering (Media Health Manufacturing)
Core
Drive Media Health manufacturing execution for next-generation High Bandwidth Memory (HBM) products, including DRAM, interface, and stacked die solutions.
Role type
Senior IC manufacturing and system engineering lead
Builds
Next-generation HBM products (DRAM, interface, stacked die) for data center and AI applications
Domain
Semiconductor manufacturing (HBM/DRAM)
Required skills
HBM product validation, manufacturing test flow development, yield improvement, circuit debug, Design-for-Test (DFT) strategy, root cause analysis, project management
Preferred skills
Semiconductor device physics, CMOS technology, DRAM architecture, Python/JMP scripting, CAD tools, Verilog simulations
Technologies
HBM, DRAM, CMOS, Verilog, Python, JMP, CAD tools
Responsibilities
Develop and validate next-generation HBM products; optimize test coverage for high-volume manufacturing; improve device and stack-level yield; reduce test time and manufacturing costs; resolve manufacturing test flow and RMA issues; mentor team members; make technical decisions on risk and prioritization; collaborate with Fab, Design, and Technology teams
Seniority
Senior, hands-on IC with mentorship responsibilities