Staff/Senior Engineer -Package Health System and Analytics
Core
Develop and execute package health monitoring, simulation, and characterization activities to ensure robust semiconductor packaging solutions.
Role type
Staff/Senior Engineer (Semiconductor Packaging & Reliability)
Builds
Quantitative package health metrics, detection mechanisms, monitoring dashboards, and predictive models for inline defect characterization.
Domain
Semiconductor manufacturing, specifically packaging, test, and reliability engineering.
Deliverable
production ML models | dashboards & analysis | infrastructure
Required skills
Semiconductor packaging process knowledge, electrical and mechanical characterization, data analytics, statistical modeling, Python/R proficiency, cross-functional collaboration.
Preferred skills
AI/ML tools experience, defect inspection systems knowledge, advanced packaging technologies (HBM, hybrid bonding, 2.5D/3D stacking).
Technologies
Python, R, defect inspection systems, inline metrology tools.
Responsibilities
Define quantitative package health metrics; develop detection mechanisms and monitoring dashboards; perform electrical and mechanical characterization of packages; implement real-time defect detection and classification; conduct correlation and causation studies between process variables and reliability outcomes; develop data pipelines for end-to-end traceability across wafer, assembly, and test stages.
Seniority
Senior, hands-on IC
