Staff Engineer, APTD Dry Etch
Core
Develop and optimize dry etch process modules for High Bandwidth Memory (HBM) and advanced packaging technologies to meet performance, yield, and reliability requirements.
Role type
Staff Engineer, Semiconductor Process R&D (Dry Etch)
Builds
Plasma-based etch processes for next-generation packaging solutions
Domain
Semiconductor manufacturing / Advanced Packaging / Dry Etch
Required skills
Dry etch process development, DOE (Design of Experiments), data analysis, first-principles reasoning, root-cause analysis, cross-functional collaboration, process integration, high-volume manufacturing readiness
Preferred skills
Plasma–material interactions, technology roadmap influence, advanced packaging (TSV, RDL, hybrid bonding, 2.5D/3D), statistical process control, Python, data automation, GenAI-enabled analysis
Technologies
Plasma etch equipment, Python, DOE tools
Responsibilities
Develop and optimize dry etch process modules; Drive process capability, cost, and variability improvements; Collaborate with process integration and adjacent teams (Wet Etch, Films, Lithography, CMP, Wafer Trim, Bonding); Perform root-cause and failure-mode analysis; Support global process transfer and high-volume manufacturing readiness
Seniority
Staff, hands-on IC with strategic influence