Staff Engineer, APTD Dry Etch
Core
Developing and scaling plasma-based dry etch processes for next-generation advanced packaging technologies, specifically High Bandwidth Memory (HBM), to enable AI-era solutions.
Role type
Staff Engineer, Semiconductor Process R&D (Dry Etch)
Builds
Production-ready dry etch process modules and advanced packaging solutions for HBM
Domain
Semiconductor manufacturing / Advanced Packaging / Plasma Physics
Required skills
Dry etch process development, DOE (Design of Experiments), data analysis, first-principles reasoning, root-cause analysis, equipment innovation, process integration, high-volume manufacturing readiness
Preferred skills
Plasma-material interactions, technology roadmap strategy, advanced packaging (TSV, RDL, hybrid bonding, 2.5D/3D), statistical process control, Python, GenAI-enabled analysis
Technologies
Python, DOE tools, statistical process control software
Responsibilities
Develop and optimize dry etch process modules for performance and yield; Drive process capability and variability improvements; Collaborate with Wet Etch, Lithography, and Bonding teams; Perform root-cause analysis and partner with equipment vendors; Support global process transfer to high-volume manufacturing
Seniority
Staff, hands-on IC with strategic influence