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Dry Etch Process Development Engineer

Lehi, UT, United States💼 Full-time🗓 2026-06-16 → 2026-07-22

Core

Developing and optimizing 300mm dry etch processes for analog ICs and embedded processors, from pilot plant to full-scale manufacturing.

Role type

Process Development Engineer (Semiconductor Manufacturing)

Builds

300mm semiconductor manufacturing processes and equipment roadmaps

Domain

Semiconductor manufacturing / Analog ICs / Embedded processors

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

300mm dry etch process development, statistical process control (SPC), Design of Experiments (DOE), data analysis, model-based problem solving, engineering change control, process release strategies, equipment and process modification, vendor partnership

Preferred skills

HKMG and/or Silicon Photonics experience, advanced CMOS device physics, reliability mechanisms in advanced logic, multiple 300mm etch platforms, conductor and dielectric etch experience, materials and electrical test characterization, AI/ML and scripting

Technologies

300mm etch platforms, advanced CMOS technologies

Responsibilities

Develops new or modified processes and defines processing/equipment requirements, compiles and evaluates test data to determine process limits, conceives and plans projects for new concepts and equipment, provides technical engineering support in manufacturing, recommends and implements equipment/process modifications to improve yields, develops and conducts statistical analysis (DOE/SPC) for yield loss, partners with vendors on equipment and process roadmaps

Seniority

Mid-Senior, hands-on IC

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