Principal Engineer – Process Development, Dry Etch, NAND
Core
Provide technical leadership for dry etch process development across critical NAND modules, shaping process roadmaps and solving high-impact structural and device challenges.
Role type
Principal Engineer (Process Development, Dry Etch, NAND)
Builds
Advanced NAND memory structures and devices for data center, AI, and mobile applications
Domain
Semiconductor manufacturing, NAND flash memory, plasma etch
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
dry etch technology fundamentals (plasma physics/chemistry, reactor types/chemistries), SPC/DOE/statistical analysis, structured root cause analysis, cross-functional program delivery, vendor engagement, technical mentorship
Preferred skills
data science basics, Python, AI-enabled analysis capability
Technologies
plasma reactors, AI-assisted tools
Responsibilities
Lead dry etch unit process and critical module development; Lead cross-functional teams to solve complex structural problems; Present and drive dry etch process and technology roadmaps; Drive advanced scalability solutions for high aspect ratio etches; Lead supplier head-to-heads and vendor engagements
Seniority
Principal, technical leadership & cross-functional execution